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SUMMARY. Smartphone users who download films, TV shows and music used to be a dedicated few. But thanks to low cost data plans and a growing audience of PC users, the smartphone market has reached 50% in the UK, up from a smalToshiba, SAI announce joint production of nanoscale planar transistor SINGAPORE, March 14, 2017 — Toshiba Corporation and Singapore Advanced Technology and Research Education is setting up a new joint venture company, called Toshiba Semiconductor Manufacturing Singapore Pte Ltd (TSMS), to jointly develop the next generation of semiconductor manufacturing processes and products for the global market. TSMS will be established at Toshiba’s site in Sembawang Industrial Estate 1, in Singapore. TSMS will have a location on the same site as the Toshiba Standard Product Manufacturing (SPM) facility in Sembawang Industrial Estate 2. SPM offers ULSI fabrication services on Toshiba’s leading 300mm C-Wafer systems for a range of semiconductor technologies, including CMOS, W-MOS and BiCMOS/BiFET and front-end processes. The joint venture company will aim to achieve a competitive advantage in semiconductor technology by contributing not only to the joint company’s existing portfolio of service, but also by actively identifying the next generation of essential technologies to develop jointly with TSMS’s advanced research and development facility. “We are now entering a new era of Moore’s Law, where the relentless march towards miniaturisation will continue,” said Chris Chapple, president of Toshiba Semiconductor Asia Pte Ltd. “We are now able to further expand the product portfolio and services available to customers through the development of new and new generations of semiconductors with TSMS.” Toshiba and SAI are jointly committed to pursuing high-growth, technology-driven innovation and competitive market positions. Together, these complementary strengths will help TSMS bring new high-growth opportunities to the global market, including in the high-growth market for advanced memory and NVM applications. The company will operate a new state-of-the-art 300mm C-Wafer production facility in Sembawang Industrial Estate 1. Toshiba and SAI are proud of their long history of collaboration for developing world-leading products, including high-reliability power electronics products, semiconductor solutions for the data centre, as well as integrated energy solutions. TSMS will c6a93da74d
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